Mehdi Abarham is a lead application engineer with a primary focus on electronics cooling applications. He has a doctorate in mechanical engineering at University of Michigan. After graduation, he worked at Ford as a research engineer for two years before joining Ansys.

Vijay Anandan is director for PCB engineering at Tessolve Semiconductor India. He has been with Tessolve for the past 10 years and has designed several complex test boards for top semiconductor companies for various ATE platforms and systems for digital, mixed, power management and RF applications. He has also worked with various PCB manufacturers in different regions and has thorough knowledge of PCB manufacturing. He has a bachelor's in electrical and electronics engineering from Anna University, Chennai, India.

James Barry is has over 40 years in manufacturing, design, engineering and reliability experience. His background is completely in PCB technology, including assembly. He is trained in engineering, applications, materials and failure analysis. He has held various positions within the PCB industry, ranging from manufacturing, R&D, sales and marketing, engineering, and corporate and executive levels. Currently he is sales and marketing manager for PCB Technologies of Israel.

With more than 40 years of experience in electronic system design and EMC, Daniel Beeker provides applications support for NXP Automotive customers worldwide. He also supports NXP customers globally with special function development tools and instrumentation (almost all of the "LFxxx" tools on the NXP website). He also specializes in EMC and signal integrity design techniques for systems and PCBs, especially in low layer count designs. Beeker teaches field-based design techniques at NXP and industry conferences worldwide. Beeker is also involved with NXP IC package design and IC development tool teams to support improved EMC performance.

An expert in designing reliable and robust electronic boards and systems, Yizhak Bot has more than 25 years of experience in reliability and safety engineering for large projects, including electronic circuits and mechanical components for defense, aerospace, telecom, manufacturing, medical, etc. He was the program manager of many defense and commercial projects of more than $25 billion. He has written articles for leading magazines, conducts seminars and gives lectures worldwide. He is also the inventor of CARE, fiXtress and apmOptimizer technology, which help designers develop more robust products. Since 1989, he has been president and CTO of BQR, a professional testing and simulation service provider and software developing firm for the EDA market. Bot is a Certified Reliability Engineer from American Society for Quality Control (ASQC) and has a degree in electronic engineering from Tel-Aviv University.

Ralf Bruening is product manager and senior consultant at the Zuken EMC Technology Centre in Paderborn/Germany. He holds a degree in computer science, electrical engineering and economics from the University of Paderborn. He has 30 years of experience in electronics and EDA. He has longtime technical co-responsibility for Zuken's high-speed design, signal integrity, power integrity and EMI solutions. Part of his responsibility is to help customers with practical signal- and power-Integrity problems and in enhancing and optimizing their PCB design flow. He is an active member of the IBIS Open Forum and regular speaker at national and international conferences.

Bill Cardoso, Ph.D., started Creative Electron in his garage after 10 years with Fermilab. Creative Electron is now the largest US manufacturer of x-ray systems to the electronics industry. At Creative Electron, he leads the team of engineers that designs and manufactures x-ray systems. He received his associate’s degree at 13 and went on to achieve a bachelor’s, master’s, and Ph.D. in electrical and computer engineering. He also has an MBA from the University of Chicago. Cardoso sits on the technical committees of SMTAI, SMTA Counterfeit Conference, SMTA LED Conference, Components for Military and Space Electronics Conference, SPIE Photonics, and the IEEE Nuclear Science Symposium. He has written two books and over 150 technical publications. He started his first company at 17 in Brazil, selling it a few years later to work for the Fermi National Accelerator Laboratory (Fermilab).

Keven Coates has been a development engineer at Geospace Technologies for five years, where he works designing low-noise seismic recording devices, industrial battery testers/chargers, and battery protection circuits. His work concentrates on embedded processors, low-noise circuits, medium-power circuits, battery safety, and battery management. He spent the previous 20 years working for Texas Instruments specializing in high-speed PCB layout/signal integrity, BGA layout, thermal issues, and PCB-friendly BGA packaging for consumer and automotive applications. He holds a bachelor’s degree from Texas A&M University.

John Coonrod is technical marketing manager for Rogers Corp, Advanced Connectivity Solutions division. He has 30 years of experience in the PCB industry. About half of this time was spent in the flexible PCB industry on circuit design, applications, processing and materials engineering. The past 16 years have been spent supporting high-frequency circuit materials involving circuit fabrication, providing application support and conducting electrical characterization studies. He is chair for the IPC-D24C High Frequency Test Methods Task Group and holds a bachelor’s in electrical engineering from Arizona State University.

Paul Cooke has more than 30 years of experience in printed board (PWB) design and manufacturing. Paul has held senior positions in operations, quality, process engineering and field application engineering, at some of the top North American PCB manufacturers. He has served on a number of IPC technical committees for the development of standards for the industry, having recently received an award for contribution to IPC-9121, “Troubleshooting for Printed Circuit Boards.” He has coauthored numerous technical papers, and works with Tier 1 companies, focusing on PCB design and reliability. He has provided DfM consulting services to the industry, along with extensive training/educational presentations from PCB 101 through enhanced reliability. His current position is focused solely on working with designers in the avionics and space industry to design and develop products with extended life and long-term reliability in harsh environments.

MICHAEL CREEDEN has over 40 years of industry experience as a PCB designer, applications engineer and business owner. He is an IPC Designer Certification Master Instructor CID+, and was a primary contributor for the CID+ (IPC-CID+ Advanced Certified Interconnect Designer) curriculum. He teaches IPC-CID/CID+ curriculum through EPTAC, and is a community college instructor. He owns San Diego PCB, which employs 20 designers, utilizing most of the major CAD tools.

Lawrence Davis is president of Advanced Assembly.

Jim DeLap is an electronics product manager for Ansys, working with the company’s customers and research team to provide the highest quality simulation workflow. He has a master’s in electrical engineering from the University of Virginia, and has been working in the microwave and signal integrity field for over 20 years. He has designed products ranging in frequency from DC to mm-wave, and has several published trade journal and conference articles. His current interests include helping customers solve challenging electro-thermal problems.

Vincent Di Lello, CID+, has designed PCBs ranging from the Pebble Watch to boards that have gone onto space and inside Las Vegas machines. A product engineer, he makes designers’ lives easier by influencing Cadence software development.

Gary Ferrari is director of technical support, Firan Technology Group. He has more than 35 years’ experience in electronics packaging and has held senior operations, quality and engineering positions, most recently as executive director and cofounder of the IPC Designers Council. He chaired the IPC Technical Activities Executive Committee, provided DfM consulting services, and spearheaded IPC’s PWB Designer Certification Program. He was inducted into the IPC Hall of Fame in 2015.

A cofounder of Nano Dimension, Simon Fried leads its USA activities, overseeing business development, marketing, sales and product management for this revolutionary additive technology. With experience working in the US, Israel and throughout Europe, he has held senior and advisory roles in startups in the solar power, medical device and marketing sectors. Previously, he worked as consultant on projects covering sales, marketing and strategy across the automotive, financial, retail, FMCG, pharmaceutical and telecom industries. He also worked at Oxford University researching investor and consumer risk and decision-making.

Ray Fugitt has more than 30 years of printed circuit board experience. He spent 15 years in manufacturing, 11 with Hadco. Joining Advanced CAM Technologies as an application engineer, he supported the CAM350 product through PADS and later the Innoveda mergers. In 2002, he joined Downstream Technologies in technical marketing and later technical sales positions. He continues to support and train for both the BluePrint PCB and CAM350 products.

Mark Finstad is senior application engineer for Flexible Circuit Technologies. He has over 30 years of experience designing and manufacturing flexible circuits for commercial, medical, and military/avionics applications. He co-chairs the IPC-2223 Design Standard for Flexible Printed boards and coauthors the Ask the Flexperts column for PCD&F magazine. Finstad is also a regular columnist for several other industry publications.

Xiao-Ming Gao has been working at Intel for 20 years and has extensive experience in signal and system, I/O circuit design, signal and power integrity analysis, and high-speed platform design. He holds bachelor’s, master’s and Ph.D. degrees in electrical engineering. He has four patents and other pending applications.

Jim Hall is principal consultant and resident Lean Six Sigma Master Black Belt with ITM Consulting. His area of responsibility includes working with OEMs, contract assemblers, and equipment manufacturers to solve design and assembly problems, optimize facility operations, as well as teach basic and new technologies in private and public forums throughout the worldwide industry. Since joining ITM in 2000, he has helped clients in such areas as SMT implementation and assembly facility setup, manufacturing yield improvement, and process audits and improvement. He is coauthor of the SMTA Process Certification Course.

Robert Hanson, MSEE, has more than 40 years' experience in design, manufacturing and testing. He has bachelor's degrees in industrial engineering and business administration and a master's in electrical engineering. Hanson has been a digital design engineer at Boeing, Rockwell, Honeywell, and Loral. He teaches and consults internationally to corporations, conventions, universities, and other entities.

Bill Hargin has 20 years of experience with PCB signal integrity. He served as product manager for Mentor Graphics’ HyperLynx SI software and, for the past five years, as director of marketing for Nan Ya Plastic’s PCB laminate division. He currently serves as Z-zero’s (PCB stackup software) director of everything.  More than 10,000 engineers and PCB designers worldwide have taken Hargin’s workshops on high-speed PCB design, and he has spent much of the past seven years focused on stackup design and PCB materials selection.

Rick Hartley is principal of RHartley Enterprises, resolving noise, signal integrity and EMI problems. Hartley has a degree in engineering from Ohio Technical Institute and 49 years of experience with companies such as L3 Avionics and BF Goodrich. He is a past member of the Editorial Review Board of Printed Circuit Design magazine and has written numerous technical papers and articles on methods to control noise, EMI and signal integrity.

Gary Hinde has been involved in PCB design since his apprenticeship started in 1975. While at Schlumberger Instruments he was involved in design and layout for a diverse range of products such as laboratory instrumentation (digital voltmeters, frequency response analysers, remote data logging and industrial transducers), aircraft flight control simulators, ground warfare simulation systems and security access systems. In 1991, he joined Cadence Design Systems as an application engineer, providing support for internal teams and customers. He has worked with a number of companies worldwide and is currently helping to develop electronic hardware system solutions for multi-fabric designs.

Taylor Hogan has been working in electronic design automation for over 30 years. His research interests include genetic optimization, machine learning, and functional programming. He holds a bachelor’s in computer science and a master’s in electrical engineering. He holds several patents in the area of constraint driven optimization of multi-substrate designs.

Jeremy Hong comes from a very hands-on and pragmatic hardware design background. He has dealt with complex mixed signal circuit board design and layout (40+ layer PCBs). Now he is a hardware reverse-engineer for Caesar Creek Software, but still does design work through a company he started in high school, Hong's Electronics. He lives in Dayton, Ohio.

Dave Hoover is a senior field application engineer at TTM Technologies, where he supports some of its top telecom customers. He has 40+ years’ experience in PCB fabrication, and has been involved with the development of HDI, microvias and other leading high-speed technologies. His career includes PCB fabricators such as Hadco/Sanmina, Data Circuits, Litronic Industries, and Multek.

Scott Kohno is president of Royal Flex Circuits.

Nick Koop is a senior field application engineer for TTM Technologies and has over 30 years of design, manufacturing and management experience in the flexible circuit industry. He developed and applied advanced PCB technologies to support a wide range medical, military, and global security applications. He is vice chairman of the IPC Flexible Circuits Committee, co-chair for the IPC-6013 Qualification and Performance Specification for Flexible Printed Boards Subcommittee, and coauthors the Ask the Flexperts column for PCD&F magazine.

Mark Laing has over 25 years’ experience in PCB manufacturing, with particular strengths in test and inspection methodologies with three test companies: Marconi instruments, GenRad and Teradyne. He then moved into software solutions for Router Solutions. Since 2010, he has worked for Mentor’s Valor division as a product marketing manager and business development manager. He has a bachelor’s in electrical and electronic engineering from Loughborough University (UK). He has been granted two patents, one in the UK and one in the US, and recently filed a third one.

Richard V. Legaspino has been cofounder and CEO of three companies and business and technical advisor to many others. He is co-inventor and owner of over 38 issued patents in the area of wafer-level packaging, chip-scale packaging, silicon interposers, 3-D and 2.5-D packaging. Author of many articles and texts on SMT, 3D IC assembly, and Fine Pitch Surface Mount Technology, one of the first textbooks on fine pitch SMT packaging and processes. In 2007 he was named “The Father of Surface Mount Assembly in the US” by the IPC, resulting from his founding and management of AWI (Santa Clara, CA). AWI (founded in 1981) was one of the first companies in the US to install AI-based equipment and specialize in automated electronic design and assembly. Marcoux cofounded ChipScale Inc., which invented and developed very-fine-pitch wafer-assembled IC packages that were widely adopted for cellphones and image sensors. Recent consulting projects involve automotive electronics, high density x-ray and radiation detecting imaging screens and medical device development.

Phil Marcoux is currently a senior PCB Engineer in Analog Devices Inc. He graduated in 1994 from Cebu Institute of Technology, Cebu City with a degree in Bachelor of Science in Electronic and Communications Engineering. Has 3-year experience in Hardware Engineering at Acer Inc. Taiwan and 5-year experience as Test Engineer in Teradyne Philippines LTD, Cebu. He joined Analog Devices Philippines on May 16 2006 as Test Manufacturing Engineer. Currently lead the simulation team in Analog Devices Philippines that supports Signal and Power Integrity simulation request across ADI sites.

Dennis Nagle has been involved with high-speed PCB design for over 29 years. At Cadence Design Systems, he is a product engineering architect, responsible for driving the technical roadmap for the Allegro Sigrity SI product line and the High-Speed Constraint Driven Flow. Prior to that, he held technical marketing and applications roles in various capacities for Cadence’s PCB design products. Before joining Cadence, he worked at Data General. He has a bachelor’s in electrical engineering from Worcester Polytechnic Institute.

Chris Nuttal joined NCAB in 2009 as UK operations director. In 2010, he became NCAB’s quality and technical manager for the worldwide group. Prior to NCAB, he was quality manager and later supply chain director of the UK’s largest independent PCB operation, with partners in China, Taiwan, Korea, Malaysia, India and UK. His responsibilities included purchasing, sourcing, logistics and warehousing. Previous to that, he was a quality engineer for tier 1/tier 2 automotive customers at a PCB manufacturer in Scotland. He has a master’s in quality management.

Sean Priddy has a 20+ year diverse background in embedded electronics product development across consumer electronics, industrial, and DoD markets. As a senior design engineer, he has developed many wireless communications products spanning cellular, Bluetooth, 802.15.4, and other proprietary networking technologies. As a systems architect, he has created a software reconfigurable wireless sensor gateway and cloud-based management platform for IoT solutions. Now as the business development director for Creation Technologies, he provides guidance to customers developing novel IoT hardware solutions.

Steven G. Pytel Jr. is principal electronics product manager at Ansys. He has a Ph.D. in signal integrity from the University of South Carolina. He previously worked at Intel as a signal integrity and hardware design engineer where he helped design blade, telecom, and enterprise servers. He has over 50 publications, with an invited book chapter on signal integrity simulation within Maxwell’s Equations: The Foundations of Signal Integrity, authored by Paul Huray. His current research interests focus on electro-thermal design challenges for digital and high power electronic devices.

Naveid M. Rahmatullah has been working for Intel for 18 years, managing multiple hardware platform teams. He has been leading the board design process and methodologies within Intel to maximize efficiency and deliver high quality platforms for client, server, and IoT products and IP validations. He holds a bachelor’s in electrical engineering, and has authored several technical papers.

Walden Rhines is president and chief executive of Mentor, a Siemens business. He was previously CEO of Mentor Graphics for 23 years and chairman for 17 years. Prior to joining Mentor, Rhines was executive vice president of Texas Instruments’ Semiconductor Group. During his 21 years at TI, he was president of the Data Systems Group and held numerous other semiconductor executive management positions. He has a bachelor’s in engineering from the University of Michigan, a master’s and Ph.D. in materials science and engineering from Stanford, and an MBA from Southern Methodist University.

Hemant Shah has been with Cadence Design Systems SPB division since 2000, most recently as product management group director – Allegro PCB & FPGA products. Previously, he was engineering director for advanced development at Xynetix Design Systems, where he also held a product marketing director role. He holds a bachelor’s in electrical engineering and a master’s in computer science.

Jay Shah is a lead application engineer at Cadence Design Systems. He has six years of experience and predominantly works around signal integrity, power integrity and PCB layout areas. He has presented papers at PCB WEST, IEEE EMC+SIPI, Embedded Systems Conference, and CDNLive. Prior to Cadence, he was a test engineer at Maharshi Electronic Systems. 

Milan Shah is president of Royal Circuit Solutions, which he purchased in 2008. He began his technology career at Apple Computer. From there he moved to Sony as director of multimedia technologies and introduced leading-edge technologies to the North American markets. He has a bachelor’s in computer information systems and business communications from Western Michigan University, and also an MBA.

Vern Solberg holds several patents for IC packaging innovations, including the folded-flex 3D package technology and is the author of Design Guidelines for Surface Mount and Fine-Pitch Technology. He is a speaker and instructor supporting several industry organization technical programs, including IPC and SMTA. He is currently an IPC Ambassador Council member, chairman of the task group that developed the IPC-7094, “Design and Assembly Process Implementation for Flip Chip and Die Size Components,” and a certified IPC trainer for IPC-A-600, “Acceptability of Printed Boards.”

Ken Taylor never designed a board in his life, nor did he build one, and he’s too old to begin now. He began his career teaching high school and college, then returned to college, eventually becoming a physicist with a global chemical corporation before moving to exciting stuff like rocket propulsion and submarine acoustics. Next came 25 years of international sales and marketing with Tektronix before moving to Polar Instruments in 2001 to manage Polar’s US operations. Notwithstanding, he understands the physics PCB transmission line impedance and has worked with engineers, board designers and board manufacturers during his entire Polar career. His teaching experience helps him convey concepts in the least threatening way.

Marco M. Villahermosa, CID, is a senior PCB design engineer at Analog Devices. He has a bachelor’s in electronics and communications engineering from Ateneo de Naga University and a master’s in ECE from Mapua Institute of Technology. Prior to joining ADI, he worked as PCB design engineer in Rohm LSI Design Philippines and line engineer at Ibiden Philippines.

Kevin Webbis a technical marketing engineer for the Valor Division of Mentor Graphics. Webb has over 35 years of experience in PCB Design, Design for Manufacturing and EDA Tool management. He has held Engineering, Management and Application Engineering positions with several major telecommunication and software companies. He holds a BS in Business Administration and a degree in Electrical Engineering.

Susy Webb, CID is a senior PCB designer with 37 years of experience. Her career includes experience in coastal and oceanographic oil exploration and monitoring equipment, point-to-point microwave network systems, and CPCI and ATX computer motherboards. She is a regular speaker at PCB, IPC and international design conferences and consults for individual companies and Designer’s Council chapters. Her presentations discuss practical implementation of complex engineering concepts into board layout, and methods to improve the overall design and flow of printed circuit boards. She has set up company standards, documentation, procedures, and library conventions for several companies. She a former writer/columnist for PCD&F magazine, and a judge for Mentor’s Technology Leadership Awards. Webb is also an active member of the IPC Designer’s Council Executive Board and education committees.

David Wiens joined Mentor in 1999 through the acquisition of VeriBest. Over the past 30+ years, he has held various engineering, marketing and management positions within the EDA industry. His focus areas have included advanced packaging, high-speed design, routing technology and integrated systems design. He holds a bachelor’s in computer science from the University of Kansas.

Vern Wnek is a Technical Marketing Engineer for the Xpedition software group. A PCB designer by trade in this great industry for 38+ years. Coming full circle to work for Mentor Graphics, a Siemens Business, after designing boards, working in board houses, assembly houses and test facilities. He has worked for service bureaus and some of the largest companies in the world, military to commercial. And now, Mentor Graphics a Siemens Business, after using the tools for over 20 years. Xpedition has been the source of his livelihood since the days of Veribest. Seeing new versions come and go, and stood side by side with designers as Mentor Graphics became the leader in PCB design software worldwide. Throughout the years, and the different PCB design tools, he states that he has ended up with the best of the best.

Albert Yanez is executive vice president and president of the Americas of AsteelFlash Group. He served as general manager and executive vice president of WW operations at Serious Energy, where he was instrumental in building a leading company in green building materials. He has over 25 years of international business, operations, equipment engineering and manufacturing engineering experience. He has held several positions such as corporate director of program management for Monierlifetile (LaFarge). He also served as general manager of Southwall Technologies, and was on the core management team of Manufacturers Services Inc., where he streamlined operations for Hewlett Packard’s laser jet and plotter manufacturing divisions. He also held senior management positions at Western Digital. He was part of the team that founded Trimedia, which became Hitachi Metals Trimedia.

Phil Zarrow founded ITM Consulting in 1993, and has been involved with PCB fabrication and assembly for more than 35 years. His expertise includes the manufacture of equipment for PCB fabrication and assembly of through-hole and surface mount technologies. In addition to his background in automated assembly and cleaning, Zarrow is recognized for his expertise in SMT soldering and design and implementation of SMT placement equipment and reflow soldering systems. Having held key technical and management positions with Vitronics, Excellon-Micronetics and Universal Instruments, he has extensive hands-on experience with setup and troubleshooting through-hole and SMT processes throughout the world. During his tenure as director of technology development for GSS/Array Technology, he was responsible for specifying and setting up medium- and high-speed assembly lines, as well as investigating and implementing emerging and leading-edge technologies, equipment and processes. He is coauthor of the SMTA Process Certification Course.


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